Laser pololei

EPLC6080 Precision Optical Fiber Laser Cutting Machine no ka PCB substrate

ʻO ka wehewehe pōkole:

ʻO ka PCB substrate precision fiber laser cutting machine e hoʻohana nui ʻia no ka microprocessing laser e like me ka ʻoki ʻana, ka wili ʻana, ka slotting, ka mākaʻikaʻi ʻana a me nā mea ʻē aʻe PCB alumini substrates, nā substrate keleawe, a me nā substrates seramika.


  • ʻOki liʻiliʻi laula humuhumu:20 ~ 40um
  • Ka pololei mīkini kiʻekiʻe:≤±10um
  • ʻO ka maikaʻi o ka incision:ʻoki maʻemaʻe, wahi liʻiliʻi i hoʻopili ʻia i ka wela, liʻiliʻi ka burr a me ka ʻoki ʻana
  • Hoʻoponopono nui:ʻo ka liʻiliʻi loa o ka huahana he 20um
  • Huahana Huahana

    PCB Substrate Precision Fiber Laser Cut Machine

    ʻO ka PCB substrate precision fiber laser cutting machine e hoʻohana nui ʻia no ka microprocessing laser e like me ka ʻoki ʻana i ka laser, ka wili ʻana a me ke kākau ʻana i nā ʻāpana PCB like ʻole, hiki ke kapa ʻia ʻo PCB laser cutting machine no ka pōkole.E like me ka ʻoki ʻana a me ka hoʻokumu ʻana o ka PCB alumini substrate, ka ʻoki ʻana a me ka hoʻokumu ʻana o ka substrate keleawe, ka ʻoki ʻana a me ka hoʻokumu ʻana o ka substrate seramika, ka hoʻokumu ʻana o ka laser substrate keleawe, ka ʻoki ʻana a me ka hana ʻana, etc.

    Nā palena ʻenehana:

    ʻO ka wikiwiki hana kiʻekiʻe 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s(Z);
    Ka pololei o ka hoonoho ana ±3um (X) ±3um (Y1&Y2) ;±5um (Z);
    Ka pololei o ka hoonoho ana ± lum (X) ; ± lum(Y1&Y2) ; ± 3um(Z);
    Mea mīkini ke kila kuhiliʻole pololei, ke kila paʻa paʻa a me nā mea ʻē aʻe ma mua a ma hope paha o ka mālama ʻana i ka ʻili
    Ka mānoanoa o ka pā 0~2.0±0.02mm;
    Laina mīkini mokulele 600mm * 800mm;
    ʻAno laser Laser fiber;
    Ka lōʻihi hawewe laser 1030-1070±10nm;
    mana laser CW1000W&CW2000W&QCW150W&QCW450W&QCW750W no ke koho;
    lako mana lako 220V± 10%, 50Hz ;AC 30A (kahi kaapuni nui);
    ʻano waihona DXF, DWG;
    Nā ana lako 1750mm*1850mm*1600mm;
    Ke kaumaha o ka lako 1800Kg;

    Hōʻike Laʻana:

    kiʻi7

    Laulā noi
    Laser micromachining o ka mokulele a me ka curved surface mea kani o ka pololei kuhiliʻole kila a me ka paakiki ma mua a ma hope o ka lapaau ana

    Kiekie precision machining
    օ ʻOki liʻiliʻi laula o ka humuhumu: 20 ~ 40um
    օ Ka pololei mīkini kiʻekiʻe: ≤ ± 10um
    օ Maikaʻi maikaʻi o ka ʻokiʻoki: ʻoki maʻemaʻe a me kahi wahi wela liʻiliʻi a me ka liʻiliʻi burr
    օ Ka hoʻoponopono ʻana i ka nui: ʻo ka liʻiliʻi o ka nui o ka huahana he 100um

    Hiki ke hoʻololi ikaika
    օ Loaʻa ka mana o ka ʻoki ʻana i ka laser, ka wili ʻana, ka māka a me nā mīkini maikaʻi ʻē aʻe o ka PCB substrate
    օ Hiki i ka mīkini PCB alumini substrate, keleawe substrate, ceramic substrate a me nā mea ʻē aʻe
    օ Hoʻolako ʻia me ka hoʻomohala ponoʻī ʻana i ka papa hana hoʻoneʻe pololei ʻelua-drive paʻa ponoʻī, ka paepae granite a me ka hoʻonohonoho ʻana i hoʻopaʻa ʻia.
    օ Hāʻawi i kahi kūlana ʻelua a me ke kūlana ʻike a me ka hoʻouka ʻana a me ka hoʻoiho ʻana i ka ʻōnaehana a me nā hana koho ʻē aʻe
    օ Hoʻolako ʻia me ka nozzle ʻokiʻoki ʻoki a me ka poʻo ʻoki laser nozzle i hoʻomohala ponoʻī ʻia օ Ua hoʻolako ʻia me ka mea hoʻopili hoʻopaʻa hoʻopaʻa ʻana i ka vacuum adsorption a me ka module ohi hoʻokaʻawale lepo lepo a me ka ʻōnaehana hoʻohemo ʻana i ka lepo a me ka ʻōnaehana hoʻomaʻamaʻa palekana.
    օ Hoʻolako ʻia me ka ʻōnaehana lako polokalamu 2D & 2.5D & CAM no ka micromachining laser.

    Hoʻolālā maʻalahi
    օ E hahai i ka manaʻo hoʻolālā o ergonomics, maʻalahi a pōkole
    օ Hoʻopili ʻia nā lako polokalamu a me nā lako hana, kākoʻo i ka hoʻonohonoho hana pilikino a me ka hoʻokele hana akamai
    օ Kākoʻo i ka hoʻolālā hoʻolālā maikaʻi mai ka pae ʻāpana a i ka pae ʻōnaehana
    օ Wehe ka mana a me ka ʻōnaehana polokalamu polokalamu micromachining laser maʻalahi e hana a intuitive interface

    Palapala ʻenehana
    օ CE
    օ ISO9001
    օ IATF16949


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