Hoʻoholo pololei 3c

ECLC6045 Mīkini ʻoki ʻoki ʻoki ʻoki ʻoki no nā mea paʻakikī paʻakikī

ʻO ka wehewehe pōkole:

ʻO ka micromachining laser o nā seramika, sapphire, daimana a me ke kila calcium, ka paʻakikī kiʻekiʻe a me ka mokulele brittleness kiʻekiʻe a me nā mea kani maʻamau.


Huahana Huahana

Nā ʻāpana ʻenehana

ʻO ka wikiwiki hana kiʻekiʻe 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s(Z);
Ka pololei o ka hoonoho ana ±3um (X) ±3um (Y1&Y2) ;±5um (Z);
Ka pololei o ka hoonoho ana ± lum (X) ; ± lum(Y1&Y2) ; ± 3um(Z);
Mea mīkini Alumina & zirconia & alumini nitride & silicon nitride & Diamond &
Sapphire & Silicon & gallium arsenide & tungsten steel, etc;
Ka mānoanoa o ka pā 0~2.0±0.02mm;
Laina mīkini mokulele 300mm*300mm;
ʻAno laser Laser fiber;
Ka lōʻihi hawewe laser 1030-1070±10nm;
mana laser CW1000W&QCW150W& QCW300W& QCW450W no ke koho
lako mana lako 220V± 10%, 50Hz ;AC 20A (kahi kaapuni nui);
ʻano waihona DXF, DWG;
Nā ana lako 1280mm*1320mm*1600mm;
Paona lako 1500Kg;

Hōʻike Laʻana

ECLC6045-2Laulā noi

օ Laser micromachining o nā seramika, sapphire, daimana a me ke kila calcium, paʻakiki kiʻekiʻe a me ka mokulele haʻahaʻa kiʻekiʻe a me nā mea kani maʻamau.

Kiekie precision machining

օ ʻOki ʻoki liʻiliʻi laula: 15 ~ 30um

օ Ka pololei mīkini kiʻekiʻe: ≤ ± 10um

օ Maikaʻi maikaʻi o ka ʻokiʻoki: ʻokiʻoki maʻemaʻe, wahi liʻiliʻi i hoʻopilikia ʻia i ka wela, liʻiliʻi ka burr a me ka ʻoki ʻoki ʻana ~ 15um

օ Ka hoʻoponopono ʻana i ka nui: ʻo ka liʻiliʻi o ka huahana he 100um

Hiki ke hoʻololi ikaika

1. Loaʻa ka mana o ka ʻoki ʻana i ka laser, ka ʻeli ʻana, ka slotting, ka māka a me nā mākau hana maikaʻi ʻē aʻe no ka mokulele a me nā mea hana curved surface.

2. Hiki i ka mīkini alumina, zirconia, alumini nitride, silicon nitride, daimana, sapphire, silicon, gallium arsenide a me ke kila tungsten

3. Hoʻolako ʻia me kahi mea hoʻokele ponoʻī i kūkulu ʻia i ka mīkini paʻa paʻa paʻa paʻa paʻa pālua, ka paepae pōhaku, ka lāʻau alumini alumini no ke koho ʻana.

4.E hoʻolako i ka hana koho, e like me ka lua kikowaena & Visual Positioning & 'akomi hānai a unloading'ōnaehana & dynamic monitoring etc.

5. Hoʻolako ʻia me ka lōʻihi lōʻihi a me ka pōkole i hoʻomohala ʻia, ka nozzle ʻoi a me ka nozzle ʻoki ʻoki poʻo laser maikaʻi.

6. Equipped me modular mea loaa a me ka lepo lawe pipeline nenoaiu

7. Hāʻawi iā ia iho i hoʻomohala ʻia i ka movable tension frame & paʻa paʻa ʻana i ka ʻūhā a me ka ʻūhā adsorption & honeycomb plate, etc.

8. Equipped me ka 2D & 2.5D & 3D CAM polokalamu lako polokalamu no ka laser micromachining.

Hoʻolālā maʻalahi

1. E hahai i ka manaʻo hoʻolālā o ergonomics, palupalu a pōkole

2.Flexible lako polokalamu & lako lako hana collocation, kākoʻo pilikino hana hoʻonohonoho & akamai hana hooponopono

3.Support hoʻolālā hoʻolālā maikaʻi mai ka pae ʻāpana i ka pae ʻōnaehana

4.Open mana & laser micromachining polokalamu polokalamu maʻalahi e hana & intuitive interface

Palapala ʻenehana

օ CE

օ ISO9001

օIATF16949


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