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Mīkini ʻoki ʻoki Laser UV

ʻO ka wehewehe pōkole:

Hoʻohana nui ʻia ka mīkini ʻoki laser Ultraviolet no ka micromachining laser precision e like me ka ʻoki ʻana i ka laser, ka ʻeli ʻana, ke kahakaha ʻana, ke kahakaha makapō, a me nā mea ʻē aʻe o nā curved a pālahalaha paha e like me nā papa PCB, nā kamera, a me nā modules ʻike manamana lima.


  • ʻOki liʻiliʻi laula humuhumu:15 ~ 30um
  • Ka pololei mīkini kiʻekiʻe:≤±15um
  • ʻO ka maikaʻi o ka incision:ʻoki maʻemaʻe, wahi liʻiliʻi i hoʻopili ʻia i ka wela, liʻiliʻi ka burr a me ka ʻoki ʻana
  • Hoʻoponopono nui:ʻo ka liʻiliʻi loa o ka huahana he 20um
  • Huahana Huahana

    mīkini ʻoki laser UV
    Hoʻohana nui ʻia ka mīkini ʻoki laser Ultraviolet no ka PCB laser segmentation a me ka drilling, camera, fingerprint recognition module FPC cutting, puka pukaaniani o ka uhi kiʻiʻoniʻoni o ka papa palupalu a paʻakikī, wehe a ʻokiʻoki, ʻili kila silika, palapala palapala seramika, nā mea hoʻohui ultra-thin. a me Copper foil, aluminum foil &, carbon fiber, glass fiber, Pet, PI and other laser cutting processing.ʻO nā mea maʻamau e like me ka ʻoki ʻana a me ka hoʻokumu ʻana o ka antenna copper foil, ka ʻoki ʻana a me ka hoʻokumu ʻana o ka papa PCB, ka ʻoki ʻana a me ka hoʻokumu ʻana o FPC, ka ʻoki ʻana a me ka hoʻokumu ʻana i ke aniani fiber, ka ʻoki ʻana a me ka hoʻokumu ʻana, ka hana ʻana i ke gula-plated probe, etc.

    Nā palena ʻenehana:

    ʻO ka wikiwiki hana kiʻekiʻe 500mm/s(X);500mm/s(Y1Y2);50mm/s(Z);
    Ka pololei o ka hoonoho ana ±3um(X)±3um(Y1Y2;;±3um(Z);
    1 Hoʻonohonoho pololei ʻana ±1um(X;;±1um(Y1Y2);±1um(Z);
    1 Mea mīkini FPC & PCB & PET & PI & copper foil & aluminum foil & carbon fiber & glass fiber & composite material & ceramic a me na mea e ae.
    Ka mānoanoa o ka pā 0~1.0±0.02mm;
    Laina mīkini mokulele 400mm*350mm;
    ʻAno laser Laser fiber UV;
    1Ka lōʻihi hawewe laser 355±5nm;
    1Ka mana laser Nanosecond & picosecond,10W & 15W no ke koho
    1Ka pinepine laser 10~300KHz
    1 Paʻa mana < ± 3% (ka hana mau no 12 mau hola);
    1Ka lako mana 220V±10%,50Hz/60Hz;AC 20A(kahi kaapuni nui)
    1 Hōʻano waihona DXF, DWG & Gebar;
    Anana 1200mm*1400mm*1800mm ;
    Ke kaumaha o ka lako 1500Kg;

    Hōʻike Laʻana:

    kiʻi10

    Laulā noi
    ʻO ka wehe ʻana a me ka ʻeli ʻana o ka PCB laser;ʻOki ʻoki ʻia ʻo FPC i ke kāmela a me ka manamana lima;Ka uhi ʻana i ka puka aniani a me ka wehe ʻana a me ka ʻoki ʻana i ka pā paʻa paʻa a palupalu;Pepa kila silikoni a me ke kākau ʻana i ka seramika;ʻO nā mea hoʻohui hui like ʻole a me nā pepa keleawe a me nā aluminika a me nā pulu kalapona a me nā pulu aniani a me ka ʻokiʻoki ʻana i ka laser Pet & PI.

    Kiekie precision machining
    օ ʻOki ʻoki liʻiliʻi laula: 15 ~ 35um
    օ Ka pololei mīkini kiʻekiʻe ≤ 10um
    օ Maikaʻi maikaʻi o ka ʻokiʻoki: ʻoki maʻemaʻe a me kahi wahi wela liʻiliʻi a me ka liʻiliʻi burr
    օ Ka hoʻoponopono ʻana i ka nui: ka liʻiliʻi o ka nui o ka huahana 50um

    Hiki ke hoʻololi ikaika
    օ Loaʻa ka mana o ka ʻoki ʻana i ka laser, ka ʻeli ʻana, ke kākau ʻana, ke kahakaha makapō a me nā ʻenehana mīkini maikaʻi ʻē aʻe no ka mokulele a me nā mea kani maʻamau.
    օ Hiki i ka mīkini FPC & PCB & PET & PI & copper foil & aluminum foil & carbon fiber & glass fiber & composite material & ceramic a me na mea e ae.
    օ Hāʻawi iā ia iho i hoʻomohala pono ʻia i ka XY superposition type & split type paʻa gantry precision motion platform & ʻōnaehana hoʻouka a me ka wehe ʻana no ke koho.
    օ Hāʻawi i ka hana o ka nānā mua ʻana i ka wahi ʻike CCD bilateral a me ka hopu ʻana a me ka wahi
    օ Hoʻolako ʻia me ka ʻōnaehana hoʻoheheʻe hoʻoheheʻe a me ka ʻōnaehana hoʻoneʻe lepo
    օ Hoʻolako ʻia me ka ʻōnaehana polokalamu 2D & 2.5D CAM i hoʻomohala ʻia no ka micromachining laser.

    Hoʻolālā maʻalahi
    օ E hahai i ka manaʻo hoʻolālā o ergonomics, nani a pōkole
    օ He maʻalahi ka hui pū ʻana o nā polokalamu a me nā hana lako, kākoʻo i ka hoʻonohonoho hana pilikino a me ka hoʻokele hana akamai.
    օ Kākoʻo i ka hoʻolālā maikaʻi a me nā mea hou mai ka pae ʻāpana a i ka pae ʻōnaehana
    օ Wehe ʻano mana, laser micro-machining software system, maʻalahi e hana & intuitive interface

    Palapala ʻenehana
    օ CE
    օ ISO9001
    օ IATF16949


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